Paul S. Ho, Kenneth A. Jackson

Electronic Packaging Materials Science VI

Symposium Held April 27-30, 1992, San Francisco, California, U.S.A. (Materials Research Society Symposium Proceedings)

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Author

Contributions

Che-Yu Li (Contributor) - Contributor

Publication

1993-09-01 - Materials Research Society

Language

English

Word Count

0 words, Guess

Page Count

0 pages

Physical Format

Hardcover

Identifiers

ISBN-10155899159X
ISBN-139781558991590
OCLC Control Number232587148
Better World Books9781558991590
Open LibraryOL12091876M

Subjects

Topics

Science/Mathematics Materials, research Electronic Engineering (Specific Aspects)Electronic apparatus and appliances, packaging

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