Thermal modeling and design of electronic systems and devices
presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Dallas, Texas, November 25-30, 1990
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Contributions
- Wirtz, R. A. - Contributor
- Lehmann, G. L. - Contributor
- American Society of Mechanical Engineers. Heat Transfer Division. - Contributor
Publication
1990 - American Society of Mechanical Engineers, New York, N.Y, New York (State)
Language
English
Word Count
25,250 words, Guess
Page Count
101 pages
Identifiers
- ISBN-100791805867
- ISBN-139780791805862
- Library of Congress Control Number90056031
- Open LibraryOL1890931M
Classifications
- DDC621.381
- LCCTK7870.25 .A53 1990
Subjects
Topics
Series Statement
- HTD ;
- vol. 153
- HTD (Series) ;
- v. 153.
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