Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
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Publication
2014 - Springer
Language
English
Word Count
63,250 words, Guess
Page Count
253 pages
Identifiers
- ISBN-139781461492665
- ISBN-101461492661
- Better World Books9781461492665
- Open LibraryOL36214690M
Classifications
- LCCTA1-2040
Subjects
Other Editions
- Fundamentals of Lead-Free Solder Interconnect Technology
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