Interconnect Technology and Design for Gigascale Integration
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Author
Contributions
- Meindl, James D. - Contributor
Publication
2003 - Springer US, Boston, MA, United States
Language
English
Word Count
102,750 words, Guess
Page Count
411 pages
Physical Format
Electronic resource
Identifiers
- Internet Archiveinterconnecttech00mein
- ISBN-101461350883
- ISBN-101461504619
- ISBN-139781461350880
- ISBN-139781461504610
and 4 more
- OCLC Control Number852790595
- Better World Books9781461350880
- Better World Books9781461504610
- Open LibraryOL27046299M
Classifications
- DDC621.3815
- LCCTK7888.4
- LCCTK7800-8360
Description
Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.
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