Contributions

  • Guven, Ibrahim - Contributor
  • Kilic, Bahattin - Contributor

Publication

2003 - Springer US, Boston, MA, Massachusetts

Language

English

Word Count

46,250 words, Guess

Page Count

185 pages

Physical Format

Electronic resource

Identifiers

  • Internet Archivefatiguelifepredi00made
  • ISBN-101461349893
  • ISBN-101461502551
  • ISBN-139781461349891
  • ISBN-139781461502555
and 4 more
  • OCLC Control Number852792388
  • Better World Books9781461349891
  • Better World Books9781461502555
  • Open LibraryOL27038263M

Classifications

  • DDC670
  • LCCTJ241
  • LCCTS1-2301TA1750-1750.
and 1 more
  • LCCTS1-2301

Description

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Subjects

Series Statement

  • The Springer International Series in Engineering and Computer Science -- 719
  • International series in engineering and computer science -- 719.

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