Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1
Die-Attach and Wafer Bonding Technology
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Publication
2019-10-18 - World Scientific Publishing Company
Word Count
270,000 words, Guess
Page Count
1,080 pages
Physical Format
Hardcover
Identifiers
- ISBN-109811201110
- ISBN-139789811201110
- Better World Books9789811201110
- Open LibraryOL47319608M
Classifications
- LCCTS195.E63 2020
Subjects
Topics
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