Proceedings, sixth international symposium
moisture and creep effects on paper, board and containers
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Author
Contributions
- Forest Products Laboratory (U.S.) - Contributor
- Technical Association of the Pulp and Paper Industry - Contributor
- International Paper Physics Committee - Contributor
Publication
2011 - U.S. Dept. of Agriculture, Forest Service, Forest Products Laboratory, Madison, Wis, Wisconsin
Language
English
Word Count
41,500 words, Guess
Page Count
166 pages
Identifiers
- Library of Congress Control Number2011451563
- OCLC Control Number741132623
- Open LibraryOL30628954M
Classifications
- DDC676/.2
- LCCTS1121 .P76 2011
Alternate Titles
- Moisture and creep effects on paper, board and containers
Description
The USDA Forest Products Laboratory sponsored the 6th International Symposium: Moisture and Creep Effects on Paper, Board and Containers at the Monona Terrace Convention Center, Madison, WI, USA on 14-15 July 2009. Attendees heard 20 technical presentations; presenters were from seven different countries and three continents. Session topics included Corrugated Performance, Moisture Flow, Component Behavior, Industry Efforts, Other Materials, Moisture and Creep Response.
Subjects
Series Statement
- General technical report FPL -- GTR-196
- General technical report FPL -- 196.
Links
Other Editions
- Proceedings, sixth international symposium: moisture and creep effects on paper, board and containers
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