Thin Film Materials
Stress, Defect Formation and Surface Evolution
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Word Count
192,000 words, Guess
Page Count
768 pages
Physical Format
Hardcover
Identifiers
- Open LibraryOL22024247M
- ISBN-100521822815
- OCLC Control Number51817229
- Library of Congress Control Number2003043937
- LibraryThing5635512
and 1 more
- Goodreads1406324
Description
"Thin films play an important role in many technological applications including microelectronic device, magnetic storage media and surface coatings. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation and surface evolution in thin films. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described wherever appropriate. While the book develops a comprehensive scientific basis with which stress, deformation and failure in thin film materials can be characterized, an attempt is also made to link the scientific concepts to a broad range of practical applications through example problems, historical notes, case studies and exercises. Of particular interest to engineers, materials scientists and physicists, this book will be essential reading for senior undergraduate and graduate courses on thin films."--Jacket.
First Sentence
Thin solid films have been used in may types of engineering systems and have been adapted to fulfill a wide variety of functions.
Subjects
Other Editions
- Thin Film Materials: Stress, Defect Formation and Surface Evolution
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