Copper Electrodeposition for Nanofabrication of Electronics Devices
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Publication
2013 - Springer London, Limited
Language
English
Word Count
70,500 words, Guess
Page Count
282 pages
Identifiers
- ISBN-139781461491767
- ISBN-101461491762
- Better World Books9781461491767
- Open LibraryOL35507858M
Classifications
- LCCQD1-999
Description
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners.
Subjects
Other Editions
- Copper Electrodeposition for Nanofabrication of Electronics Devices
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