Manufacturing Challenges in Electronic Packaging
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Author
Contributions
- Chen, W. T. - Contributor
Publication
1998 - Springer US, Boston, MA, United States
Language
English
Word Count
65,250 words, Guess
Page Count
261 pages
Physical Format
Electronic resource
Identifiers
- Open LibraryOL27072643M
- Internet Archivemanufacturingcha00leey
- ISBN-101461376599
- ISBN-101461558034
- ISBN-139781461376590
and 4 more
- ISBN-139781461558033
- OCLC Control Number851818690
- Better World Books9781461376590
- Better World Books9781461558033
Classifications
- DDC670
- LCCTJ241
- LCCTP1-1185
Description
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
Subjects
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