Chemical-Mechanical Planarization of Semiconductor Materials
Our rough guess is there are 107,000 words in this book.
At a pace averaging 250 words per minute, this book will take 7 hours and 8 minutes to read. With a half hour per day, this will take 14 days to read.
How long will it take you?
This book will take an estimated to read at a reading speed averaging words per minute. With 30 minutes per day, this will take to read.
Enter your reading speedYou can take one of our WPM reading speed tests to find your reading speed.
Create a free account to track your reading progress, build your reading list, and set reading goals.
Author
Publication
2004 - Springer Berlin Heidelberg, Berlin, Heidelberg, Germany
Language
English
Word Count
107,000 words, Guess
Page Count
428 pages
Physical Format
Electronic resource
Identifiers
- Internet Archivechemicalmechanic00oliv
- ISBN-103642077382
- ISBN-103662062348
- ISBN-139783642077388
- ISBN-139783662062340
and 4 more
- OCLC Control Number851380824
- Better World Books9783642077388
- Better World Books9783662062340
- Open LibraryOL27023844M
Classifications
- DDC620.11
- LCCTA404.6
- LCCTA418.5-.84
Description
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Subjects
Series Statement
- Springer Series in Materials Science -- 69
Reader Reviews
No reviews yet for this book.
Be the first to share your thoughts!