Through Silicon Vias
Materials, Models, Design, and Performance
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Publication
2016 - Taylor & Francis Group
Language
English
Word Count
58,000 words, Guess
Page Count
232 pages
Identifiers
- ISBN-139781498745529
- ISBN-101498745520
- OCLC Control Number964699022
- Better World Books9781498745529
- Open LibraryOL28839374M
Classifications
- LCCTK7874.53.K38 2017
- LCCTK7874.53 .K38 2017eb
Subjects
Topics
MechanicalEngineeringIntegrated circuitsTECHNOLOGY & ENGINEERINGCircuits intégrés tridimensionnelsThree-dimensional integrated circuitsInterconnected electric utility systemsInterconnects (Integrated circuit technology)Interconnexions (Technologie des circuits intégrés)
Other Editions
- Through Silicon Vias: Materials, Models, Design, and Performance
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