Failure Analysis of Integrated Circuits
Tools and Techniques
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Author
Publication
1999 - Springer US, Boston, MA, Massachusetts
Language
English
Word Count
63,750 words, Guess
Page Count
255 pages
Physical Format
Electronic resource
Identifiers
- Internet Archivefailureanalysisi00wagn
- ISBN-101461372313
- ISBN-101461549191
- ISBN-139781461372318
- ISBN-139781461549192
and 4 more
- OCLC Control Number851759815
- Better World Books9781461372318
- Better World Books9781461549192
- Open LibraryOL27038102M
Classifications
- DDC620.11295
- DDC620.11297
- LCCTA1750-1750.22
and 2 more
- LCCTA1750-1750.22TK1-99
- LCCQC374-379
Description
Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.
Series Statement
- The Springer International Series in Engineering and Computer Science -- 494
- International series in engineering and computer science -- 494.
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