Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
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Author
Publication
2017-09-08 - Springer
Word Count
34,250 words, Guess
Page Count
137 pages
Physical Format
Hardcover
Identifiers
- ISBN-109811061645
- ISBN-139789811061646
- Better World Books9789811061646
- Open LibraryOL30111366M
Classifications
- LCCTS1-2301
Subjects
Other Editions
- Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
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