Reflow soldering processes and troubleshooting
SMT, BGA, CSP and flip chip technologies
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Word Count
67,500 words, Guess
Page Count
270 pages
Identifiers
- Open LibraryOL13630896M
- ISBN-100750672188
- OCLC Control Number46929244
- OCLC Control Number123123425
- OCLC Control Number824488333
and 3 more
- OCLC Control Numberreflowsolderingp00phdn
- Library of Congress Control Number2001031713
- Goodreads997778
Classifications
- LCCTK7836 .L43 2002
Subjects
Topics
GeneralDigitalElectronicsManufacturingMicroelectronicsElectric connectorsIntegrated circuitsElectronic packagingSolder and solderingIndustrial technologyChemical & biochemicalDesign and constructionTECHNOLOGY & ENGINEERINGElectronic apparatus and appliancesProfessional, career & trade -> electronics -> generalTrades & technology -> industrial technology -> manufacturingElectronic apparatus and appliances -- Design and constructionProfessional, career & trade -> engineering -> chemical engineeringTrades & technology -> industrial technology -> industrial technology
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