Fatigue life prediction of solder joints in electronic packages with ANSYS
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Author
Contributions
- Guven, Ibrahim. - Contributor
- Kilic, Bahattin. - Contributor
Publication
2002 - Kluwer Academic Publishers, Boston, Mass, Massachusetts
Language
English
Word Count
46,250 words, Guess
Page Count
185 pages
Identifiers
- ISBN-101402073305
- ISBN-139781402073304
- Library of Congress Control Number2002038928
- Better World Books9781402073304
- Open LibraryOL3565730M
Classifications
- DDC621.381/046
- LCCTK7870.15 .M32 2002
- LCCTS1-2301TA1750-1750.
Subjects
Topics
MetalsFatigueForecastingMetals, fatigueQuality controlMetals -- FatigueElectronic packagingSolder and solderingComputer-aided designANSYS (Computer system)Service life (Engineering)Solder and soldering -- Quality controlService life (Engineering) -- ForecastingElectronic packaging -- Computer-aided design
Series Statement
- Kluwer international series in engineering and computer science ;
- SECS 719
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