Electronic packaging materials science III
symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A.
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Contributions
- Jaccodine, Ralph. - Contributor
- Jackson, Kenneth A. - Contributor
- Sundahl, Robert C. - Contributor
- Materials Research Society. - Contributor
Publication
1988 - Materials Research Society, Pittsburgh, Pa, Pennsylvania
Language
English
Word Count
119,750 words, Guess
Page Count
479 pages
Identifiers
- Open LibraryOL17928109M
- ISBN-100931837766
- OCLC Control Number18070100
- Library of Congress Control Number88009395
- Goodreads335617
Classifications
- DDC621.381/046
- LCCTK7870 .E218 1988
Subjects
Topics
Series Statement
- Materials Research Society symposium proceedings -- v. 108.
Other Editions
- Electronic packaging materials science III: symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A.
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