Heat sinks (Electronics)

Encyclopedia of Thermal Packaging

Avram Bar-Cohen

Design and analysisof heat sinks

Allan D. Kraus, Avram Bar-Cohen.

Analysis of ultimate-heat-sink spray ponds

R. Codell.

Advanced Thermal Management Materials

Guosheng Jiang, Ken Kuang, Liyong Diao

Comparison between field data and ultimate heat sink cooling pond and spray pond models

R. Codell

A method to predict the thermal performance of printed circuit board mounted solid state devices

by Matthew D. Kelleher

Analysis of ultimate heat sink cooling ponds

R. Codell, W.K. Nuttle

I-THERM V: May 29-June 1, 1996, Buena Vista Palace Hotel, Orlando, FL, U.S.A.

co-sponsored by ... the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME) ... [et al.].

ITherm'98: the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electric Systems : Seattle, Washington, USA, May 27-30, 1998

edited by Sushil H. Bhavnani, Gary B. Kromann, Douglas J. Nelson.

Cae - CAD Application to Electronic Packaging: 1994 International Mechanical Engineering Congress & Exposition, Chicago, Illinois - November 6-11, 199 (Eep -)

D. Agonafer