A method to predict the thermal performance of printed circuit board mounted solid state devices
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Author
Contributions
- Naval Postgraduate School (U.S.) - Contributor
Publication
1975 - Naval Postgraduate School, Monterey, Calif, California
Language
English
Word Count
13,250 words, Guess
Page Count
53 pages
Identifiers
- Internet Archivemethodtopredictt00kell
- OCLC Control Number429904319
- Open LibraryOL25474820M
Description
The objective was to formulate a design procedure to be used in the prediction of the thermal performance of printed circuit board mounted solid state devices (specifically 14 and 16 pin DIP's and TO-3 and TO-66 transistor cases). The project consists of an analytical phase which constitutes the actual formulation of the design procedure in the form of a digital computer program with appropriate documentation and an experimental phase which involves testing of actual P-C boards to verify the analytical model.
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