Topic

Semiconductor wafers

112 books

The invention of the silicon chip: a revolution in daily life cover

The invention of the silicon chip: a revolution in daily life

Windsor Chorlton

Handbook of semiconductor wafer cleaning technology: science, technology, and applications cover

Handbook of semiconductor wafer cleaning technology: science, technology, and applications

edited by Werner Kern.

Electrolytic in-process dressing (ELID) techologies: fundamentals and applications cover

Electrolytic in-process dressing (ELID) techologies: fundamentals and applications

editors, Hitoshi Ohmori, Ioan D. Marinescu, Kazutoshi Katahira

Ultra Clean Processing of Silicon Surfaces (Solid State Phenomena) cover

Ultra Clean Processing of Silicon Surfaces (Solid State Phenomena)

Marc Heyns, International Symposium on Ultra Clean P, Marc Meuris, Paul Mertens

Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: physics and applications cover

Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: physics and applications

organizers/editors, C.E. Hunt ... [et al.]

Semiconductor capital equipment--profiles 1999 cover

Semiconductor capital equipment--profiles 1999

authors, Jim Griffin, Dick Potter ; editor, Terri McGrath.

Noise temperature measurements on wafer

J. Randa

High-density magnetic recording and integrated magneto-optics: materials and devices : symposium held April 12-16, 1998, San Francisco, California, U.S.A. cover

High-density magnetic recording and integrated magneto-optics: materials and devices : symposium held April 12-16, 1998, San Francisco, California, U.S.A.

editors, James Bain ... [et al.].

1996 1st International Symposium on Plasma Process-Induced Damage: 13-14 May 1996, Santa Clara, California, USA cover

1996 1st International Symposium on Plasma Process-Induced Damage: 13-14 May 1996, Santa Clara, California, USA

Kim P. Cheung, Moritaka Nakamura, and Calvin T. Gabriel, editors ; technical co-sponsors, IEEE/Electron Devices Society, American Vacuum Society, Japanese Society of Applied Physics.

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding: science, technology, and applications cover

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding: science, technology, and applications

editors, Ulrich Gösele ... [et al.] ; Electronics Division [of the Electrochemical Society].

Showing 10 of 112 books

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