Chip Scale Package
Design, Materials, Process, Reliability, and Applications
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Publication
1999-02-28 - McGraw-Hill Professional
Language
English
Word Count
141,000 words, Guess
Page Count
564 pages
Identifiers
- Open LibraryOL7295618M
- ISBN-139780070383043
- ISBN-100070383049
- OCLC Control Number40453052
- OCLC Control Number761966593
and 4 more
- Internet Archivechipscalepackage00lauj
- Library of Congress Control Number98053224
- Goodreads1589144
- LibraryThing3758458
Classifications
- LCCTK7874.L3167 1999
Description
The first comprehensive, in-depth guide to chip scale packaging (CSP), this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to: solve technical and design issues; find the most efficient, cost-effective CSP solutions for deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, and other major companies; and learn about CSP products under development.
Subjects
Topics
Other Editions
- Chip Scale Package: Design, Materials, Process, Reliability, and Applications
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