Books by John H. Lau
Total count: 16
Solder Joint ReliabilityTheory and applicationsSpringer1991-01-15
Mechanics of Solder Alloy Interconnects (Electrical Engineering)Springer1993-01-01
Chip On BoardTechnology for Multichip Modules (E; Ectrical Engineering)Springer1994-01-15
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assembliesMcGraw-Hill1997-01-01
Electronic PackagingDesign, Materials, Process, and Reliability1 editionMcGraw-Hill Professional1998-02-01
Chip Scale PackageDesign, Materials, Process, Reliability, and Applications1 editionMcGraw-Hill Professional1999-02-28
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA AssembliesMcGraw-Hill Professional2000-02-08
MicroviasFor Low Cost, High Density Interconnects1 editionMcGraw-Hill Professional2001-04-26
Electronics Manufacturingwith Lead-Free, Halogen-Free, and Conductive-Adhesive Materials1 editionMcGraw-Hill Professional2002-08-23
Assembly and Reliability of Lead-Free Solder JointsSpringer2020-05-30
Chiplet Design and Heterogeneous Integration PackagingSpringer2023-01-01