Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
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Author
Contributions
- Pao, Yi-hsin. - Contributor
Publication
1997 - McGraw-Hill, New York, New York (State)
Language
English
Subjects
Topics
TestingReliabilitySolder and solderingMicroelectronic packagingSolder and soldering -- TestingMultichip modules (Microelectronics)Microelectronic packaging -- ReliabilityMultichip modules (Microelectronics) -- Testing
Series Statement
- Electronic packaging and interconnection series
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