Junctions

MOS Interface Physics Process and Characterization

Shengkai Wang, Xiaolei Wang

Handbook of semiconductor interconnection technology

edited by Geraldine Cogin Schwartz, K.V. Srikrishnan, Arthur Bross.

Copper-fundamental mechanisms for microelectronic applications

Shyam P. Murarka, Igor V. Verner, Ronald J. Gutmann

Advances in Research and Development, Volume 23: Modeling of Film Deposition for Microelectronic Applications (Thin Films)

Maurice H. Francombe, John L. Vossen

Semiconductors and Semimetals: Cadmium Telluride (Semiconductors and Semimetals)

Albert C. Beer, R. K. Willardson

Materials, technology and reliability for advanced interconnects and low-k dielectrics: symposium held April 23-27, 2000, San Fransico, California, U.S.A.

editors, G.S. Oehrlein ... [et al.].

Proceedings of the IEEE 2002 International Interconnect Technology Conference: June 3-5, 2002, Hyatt Regency Hotel, Burlingame, CA]

the IITC is sponsored by the IEEE Electron Devices Society.

Materials, technology, and reliability for advanced interconnects and low-k dielectrics--2004: symposium held April 13-15, 2004, San Francisco, California, U.S.A

editors, R.J. Carter ... [et al.].

Materials, technology and reliability for advanced interconnects--2005: symposium held March 28-April 1, 2005, San Francisco, California, U.S.A

editors, Paul R. Besser ... [et al.]

Proceedings of the IEEE 2004 International Interconnect Technology Conference: Hyatt Regency Hotel, Burlingame, CA, June 7-9, 2004

IEEE Electron Devices Society