Junctions

Advances in Research and Development, Volume 23: Modeling of Film Deposition for Microelectronic Applications (Thin Films)

Maurice H. Francombe, John L. Vossen

MOS Interface Physics Process and Characterization

Shengkai Wang, Xiaolei Wang

Copper-fundamental mechanisms for microelectronic applications

Shyam P. Murarka, Igor V. Verner, Ronald J. Gutmann

Handbook of semiconductor interconnection technology

edited by Geraldine Cogin Schwartz, K.V. Srikrishnan, Arthur Bross.

Proceedings of the IEEE 2004 International Interconnect Technology Conference: Hyatt Regency Hotel, Burlingame, CA, June 7-9, 2004

IEEE Electron Devices Society

Semiconductors and Semimetals: Cadmium Telluride (Semiconductors and Semimetals)

Albert C. Beer, R. K. Willardson

Proceedings of the IEEE 2002 International Interconnect Technology Conference: June 3-5, 2002, Hyatt Regency Hotel, Burlingame, CA]

the IITC is sponsored by the IEEE Electron Devices Society.

Materials, technology, and reliability for advanced interconnects and low-k dielectrics--2004: symposium held April 13-15, 2004, San Francisco, California, U.S.A

editors, R.J. Carter ... [et al.].

Materials, technology and reliability for advanced interconnects and low-k dielectrics: symposium held April 23-27, 2000, San Fransico, California, U.S.A.

editors, G.S. Oehrlein ... [et al.].

Metal-semiconductor interfaces

edited by Akio Hiraki.