Electrochemical metallizing

Advanced metallization and interconnect systems for ULSI applications in 1997: proceedings of the conference held September 30-October 2,1997, in San Diego, California, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A., a parallel session of the conference was held from October 21-22, 1997, in Tokyo, Japan

editors, Robin Cheung ... [et al.].

Electrochemical processing in ULSI fabricatrion III: proceedings of the International Symposium

editors, P.C. Andricacos ... [et al.] ; sponsoring Divisions, Electrodeposition, Dielectric Science and Technology, Electronics.

Silver metallization: stability and reliability

Daniel Adams, Terry L. Alford, and James W. Mayer.

Electrochemical Processing in Ulsi Fabrication III

Panayotis C. Andricacos

Advanced metallization for ULSI applications, 1992: proceedings of the conference held October 20-22, 1992, in Tempe, Arizona

sponsored by Continuing Education in Engineering, University Extension, University of California, Berkeley, California, U.S.A. ; editors, Timothy S. Cale, Fabio S. Pintchovski ; associate editors, Robert S. Blewer ... [et al.].

Stress induced phenomena in metallization: fourth international workshop, Tokyo, Japan, June, 1997

editors, Hidekazu Okabayashi, Shoso Shingubara, Paul S. Ho.

Proceedings of the Third Symposium on Electrochemically Deposited Thin Films

editors, Milan Paunovic, Daniel A. Scherson.

Interconnect and contact metallization for ULSI: proceedings of the international symposium

editors, G.S. Mathad, H.S. Rathore, Y. Arita ; [sponsored by] Dielectric Science and Technology, Electronics, and Electrodeposition Divisions.

Advanced metallization for ULSI applications in 1993: proceedings of the conference held October 5-7, 1993, San Diego, California, U.S.A., and October 26-27, 1993, Tokyo, Japan sponsored by Continuing Education in Engineering, University Extension, University of California, Berkeley, U.S.A.

editors, David P. Favreau, Yosi Shacham-Diamand, Yasuhiro Horiike.

Advanced metallization for ULSI applications: proceedings of the conference held October 8-10, 1991, at AT&T Bell Laboratories, Murray Hill, New Jersey, U.S.A., and October 28-30, 1991, Tokyo, Japan

sponsored by Continuing Education in Engineering, University Extension, University of California, Berkeley, U.S.A. ; editors, Virendra V.S. Rana, Rajiv V. Joshi, Iwao Ohdomari ; associate editors, Robert S. Blewer ... [et al.].